표 2. | Table 2. Package 주요 소재 열전도성 | Thermal conductivity of package materials.

Material	Thermal Conductivity[W/(m K)]
	@25 °C	@100 °C
CPC141	200	195
Tungsten	167	159
Molybdenum	142	138
Cu-W (85W-15Cu)	184	178