표 4. | Table 4. EMI 필터 보드 레이어 치수 및 물성 | Dimensions and properties of board layers.

Subclass	Type	Materials	Thickness [mm]
	Dielectric	Solder mask	0.012
Top	Conductor	Copper	0.035
	Dielectric	FR-4	0.18
Layer2	Conductor	Copper	0.035
	Dielectric	FR-4	0.19
Layer3	Conductor	Copper	0.035
	Dielectric	FR-4	0.18
Bottom	Conductor	Copper	0.035
	Dielectric	Solder mask	0.012