표 5. | Table 5. 송수신모듈 조립체 수신 RF budget | Transmit/receive module assembly receive RF budget.

Item	Component	Input (dBm)	Input (dBm)	Acc. gain (dB)	Output (dBm)	NF (dB)
Replica path board	SMP conn.	−40	−0.2	−0.2	−40.2	0.2
	Coupler	−40.2	−0.3	−0.5	−40.5	0.5
	SMP conn.	−40.5	−0.25	−0.75	−40.75	0.75
TRM	SMP conn.	−40.75	−0.25	−1	−41	1
	Circulator	−41	−0.7	−1.7	−41.7	1.7
	Coupler	−41.7	−0.5	−2.2	−42.2	2.2
	Limiter	−41.7	−0.4	−2.6	−42.6	2.6
	Coupler	−42.6	−0.5	−3.1	−43.1	3.1
	Limiter	−43.1	−0.4	−3.5	−43.5	3.5
	LNA	−43.5	18.5	15	−25	4.7
	LNA	−25	18.5	33.5	−6.5	4.71
	Corechip	−6.5	6	39.5	−0.5	4.72
	SMP conn.	−0.5	−0.25	39.25	−0.75	4.72
4:1 RF com./div. board	SMP conn.	−0.75	−0.25	39	−1	4.72
	Combiner	−1	−0.6	38.4	−1.6	4.72
	SMA conn.	−1.6	−0.2	38.2	−1.8	4.72
Total	−	−	−	38.2	−1.8	4.72