표 4. | Table 4. 송수신모듈 조립체 송신 RF budget | Transmit/receive module assembly transmit RF budget.

Item	Component	Input (dBm)	Input (dBm)	Acc. gain (dB)	Output (dBm)
4:1 RF Com./Div. board	SMA conn.	-	−0.2	−0.2	-
	Divder	-	−6.6	−6.8	-
	SMP conn.	-	−0.25	−7.05	-
TRM	SMP conn.	-	−0.25	−7.3	-
	Corechip	-	6	−1.3	-
	DRA	-	21.8	20.5	-
	HPA	-	17.09	37.59	-
	Circulator	-	−1	36.59	-
	SMP conn.	-	−0.25	36.34	-
Replica path board	SMP conn.	-	−0.25	36.09	-
	Coupler	-	−0.3	35.79	-
	SMP conn.	-	−0.2	35.59	-
Total	-	-	-	35.59	00.0